Hibiki Seiki Co., Ltd. "Ultra-thin Precision Machining"
Responding to lightweight development projects through volume removal! Introducing ultra-thin precision machining.
This is an introduction to "Ultra-thin Precision Cutting Processing" handled by Hibiki Seiki Co., Ltd. The foundation of our technology was built on vacuum components in the semiconductor industry, specifically micron-level processing of thin-walled metal parts commonly used in this field. We have been continuously improving our skills while facing the demands of this technology for a long time. Recently, we have been proposing added value through ultra-thin precision cutting processing for parts aimed at lightweight development, including in the aerospace sector. [Features] ■ Supports lightweight development projects through volume removal *For more details, please refer to the external link page or feel free to contact us.
- Company:ひびき精機
- Price:Other